The Mundt Laser Interconnect Bonder IB-1284 was developed for special applications that require high reliability connections with large conductors.   

The patented process utilizes a laser to weld flat ribbons and flex circuits in place without the forces, vibrations and heat from ultrasonic and resistance welders.  This process provides flat ribbon connections with up to 100 times the reliability of round wires bonded with ultrasonics.   

Connections can be made to terminals that are mechanically too unstable for ultrasonic bonding.

This process offers multiple benefits such as:

• This process is not plagued with dirty weld tip problems as are resistance welders.
• Linear motors and high resolution scales ensure fast, smooth motion with unprecedented accuracy and repeatability.
• High flexibility design with five axes of motion (X, Y, Z, touch down and rotary) provide versatility of motion to handle virtually any application.
• User programmable touch down and ribbon clamping forces enables the machine to handle a wide variety of ribbon sizes and operate on fragile and high current parts.

This Class I enclosed machine has a large 305mm x 203mm x 100mm work envelope and a small floor footprint.  Click for printable brochure

Computer controlled solid state lighting provides the precise high reliability illumination necessary for each lighting need.  The system is complete with 4 vision cameras for pattern recognition, registration and process viewing.

The machine’s PC based control system is very agile and easily adapted to the user’s application, as well as providing data logging and QC functions for high reliability processes. 

Vision and machine functions are selected on the PC based control system and displayed on the system monitor.